BOTH Supports Successful Equipment Move-In at Wuhan’s Advanced Chip Packaging Pilot Platform

As semiconductor process scaling approaches physical limits, advanced packaging has become a key pathway for technological progress in the integrated circuit industry in the post-Moore era. Phase II of the Wuhan Advanced Chip Packaging Pilot Platform recently completed equipment move-in, marking a new stage in preparations for pilot-scale research and development.

A major project in China’s deep-tech sector, the platform focuses on advanced packaging technology development and commercialization. It brings together basic research, proof of concept, research and development, small-scale trials, pilot production, and industrial-scale deployment, accelerating the transfer of research breakthroughs into manufacturing applications. Once completed, the platform is expected to attract specialist teams and industry resources from across the value chain, supporting the advancement of the region’s high-end chip industry cluster.

Drawing on its established expertise in cleanroom systems for the semiconductor industry, BOTH provides services throughout project execution across key disciplines, including cleanroom systems, central utilities, and mechanical and electrical (M&E) systems. These systems underpin chip packaging operations, which demand stringent cleanliness control, stable environmental conditions, and precise M&E system performance. During construction, BOTH coordinated detailed design, on-site installation, and system commissioning to complete core system works efficiently, laying the groundwork for subsequent project delivery.

“Successful equipment move-in lays a solid foundation for the next stages of pilot-scale research and development and the transition toward industrial application. BOTH will continue to provide efficient, high-quality services, meeting client requirements and supporting the project’s continued progress.”